In today's society, the pace of development of science and technology is getting faster and faster, the production process of precision parts is becoming more and more complex, and the process cost is getting higher and higher. In order to effectively control the process quality and analyze the failure, the real-time testing of products, especially the non-destructive testing of invisible parts of devices (micro cracks, tiny air gaps and holes in devices, etc.), needs a necessary technical means.

Ultrasonic scanning microscope is a technique used to detect the surface, internal area and internal projection of objects and produce high-resolution feature images. It is widely used in the field of non-destructive testing QC key equipment because it can obtain the acoustic image reflecting the internal information of the object.

Ultrasonic scanning Inspection, or SAM, is a powerful non-invasive and non-destructive method for examining the internal structure of optically opaque materials. Depth-specific information can be extracted and applied to create 2D and 3D images. A high frequency ultrasonic wave produced by an ultrasonic transducer reaches the sample through a coupling medium (e.g., deionized water, alcohol). Because the transmission of ultrasonic requires the medium to be continuous, so such as pores, impurities, layers, cracks and other discontinuous interfaces will affect the ultrasonic signal propagation, signal will occur reflection or refraction. When the ultrasonic wave passes through the sample, due to the different acoustic resistance, there will be reflected waves in the interface with defects or poor bonding. Through the scanning axis equipped with ultrasonic transducer, the test product can be scanned at a high speed and accurately, and a picture can be obtained (different images can be obtained through different ultrasonic scanning methods). Layered interfaces or defects can be detected from the selected depth and plane of the sample or from the bonding interface. SAM works by directing focused UHF sound from an ultrasound transducer to a tiny spot on a target object. Ultrasonic waves are scattered, absorbed, reflected or propagated as they pass through a material. Detect the direction of the scattered pulse and measure the TOF "time of flight" to determine the presence of a boundary or object and its distance. Create a 3D image by scanning an object point by line. Scan data are digitally captured and processed by special imaging software and filters to address specific focal areas in single or multiple layers.

Internal defects, such as cracks, delamination and pores, can cause electronic products to fail. Therefore, in the whole process of electronic product assembly, it is a very critical problem to detect whether the device has internal defects before assembly, and a detection method is also needed. Ultrasonic scanning microscope is one of the most important nondestructive testing equipment for these tests, which can identify the defective devices and avoid increasing the cost of subsequent processing and production, so as to improve the qualified rate of the assembly line.

Detection of semiconductors by water-immersed ultrasonic scanning microscope

Main application fields: including semiconductor, material science and biomedicine (this kind of sample testing has a very high frequency requirement. At present, only the S500 model developed by He Zhi Manufacturing Company can achieve high frequency in China). It can detect a variety of defects inside the device: cracks, layers, inclusions, attachments, voids, etc. The difference of acoustic impedance inside the material, the shape and size of the defect, and the location of the defect can be determined by image contrast. Microelectronics plastics packaging IC, on-chip board (COB), chip type packaging (CSP), flip chip, stacked packaging, coil type automatic bonding (TAB), multilayer ceramic substrate printed circuit (MCM), printed circuit board (PCB), sticky crystal sheet and other microelectronics mechanical system sticky crystal sheet, manufacturing process evaluation, Packaging commonly used testing materials Ceramics, glass, metal, powder metal, plastic, synthetic Other chip LABS, biochips and microarray chips, filter cartridges, packaging, seals, microjet technology, polyethylene/foil bags, welders, sensors