When X-rays pass through matter, a series of extremely complex physical processes occur due to the interaction between the rays and the matter. As a result, the rays are absorbed and propagated, losing some of their energy and diminishing in intensity. This condition is called radiative decay. The essence of X-ray radiation examination is based on the difference in radiation energy attenuation between the inspected workpiece and the insufficient internal medium. This difference can lead to a difference in the intensity of the radiation after it passes through the workpiece, thus resulting in an image due to the lack of radiation. Projected on a photosensitive material (film) processed in a darkroom. After the defect image is obtained, the nature of the defect inside the workpiece and the level of the negative film are evaluated according to the specification.

For some items that cannot be detected by their appearance or that cannot reach the inspection location, X-rays have a strong penetration capacity because the density of the materials they penetrate is different, and therefore the light intensity is different. X-ray examination can produce corresponding images of these different light intensities, and then clearly show the internal structure of the object under test, and then complete the target examination without damaging the object under test.

After nearly 100 years of development with the original film X-ray technology, X-ray examination technology has formed a relatively complete X-ray examination technology system, composed of X-ray photography, X-ray real-time imaging, X-ray.

According to the method of obtaining the inspection image of the workpiece, the X-ray inspection technology can be divided into X-ray photography inspection technology and data radiography inspection technology. X-ray photography has a long history, mature technology and wide application, which has laid a solid foundation for the development of other radiography techniques. Data ray detection technology mainly includes real-time X-ray imaging technology, X-ray fault block imaging CT imaging detection technology, X-ray microCT imaging detection technology, X-ray cone-beam CT three-dimensional imaging detection technology, etc.

1. It can be used to detect whether some metal materials and parts, electronic parts or parts, electronic parts or LED parts have cracks, whether there are foreign bodies.

2. Can detect and analyze whether there is internal deviation of BGA, circuit board, etc.

3. It can be used to detect and judge no broken wire and other defects in BGA welding, such as air welding and air welding.

4. It can detect and analyze the internal conditions of cables, plastic parts, microelectronic systems, adhesives and seals.

5. It is used to check whether there are bubbles and cracks in the porcelain castings.

6. Check the IC packaging for defects, such as layer separation, rupture, gap, etc.

7. The application of printing industry is mainly manifested in the paperboard production process without defects, Bridges and short circuits.

8. Spot welding is usually checked for gaps in SMT.

9. In integrated circuits, it is usually checked whether there is short circuit, short circuit or abnormal connection of various connection lines.

We find that X-ray detection has such a wide range, but in using X-ray detection, we also have to understand the scientific examination procedures.

1. First, determine the type of sample, or the detection location and requirements of the material.

2. Send the sample to the X-ray checkpoint.

3. After inspection, analyze the resulting image.

4. Mark the location and type of the problem.