In the process of PCBA processing, because many high-precision circuit boards have many BGA and IC chips, the key components of packaging cannot directly see the internal welding from the welding surface. PCBA processing plant must be equipped with relevant testing equipment.

Therefore, this kind of welding detection equipment is mainly the X-RAY detection equipment we are talking about today.

X-ray is mainly used for the transmitter to send high-energy electrons in the machine and generate sample X-ray through imaging. Because the density of each structure in the sample is different, X-ray images displayed in different objects will have a difference in black and white grayscale, and then display the position and shape of defects in the sample. X-ray test is a non destructive sample analysis, and other tests can be conducted later.

Application fields of X-ray inspection

1. IC observes the internal defects of the package (breaks, holes in packaging materials, cracks and other abnormalities); 2. Observe the welding of the assembled electronic circuit board (such as empty welding, hair removal, bridging and other abnormal phenomena); 3. Analysis of spot welding hole ratio; 4. Observe various materials from the front, side and bevel; 5. Observe the filling of porous structure.

With the continuous maturity of detection technology and the continuous upgrading and iteration of image processing algorithm, X-ray can basically realize the measurement and inspection functions of various defects in PCBA, and is gradually developing to 3D/CT on this basis. It ensures that the processing technology of PCBA processing plant is increasingly improved and the product reliability is gradually improved.